This is an overview of chipsets sold under the AMD brand, manufactured before May 2004 by the company itself, before the adoption of open platform approach as well as chipsets manufactured by ATI Technologies after October 2006 as the completion of the ATI acquisition.
North- and Southbridges
Northbridges
AMD-xxx
Model | Code name | Released | CPU support | Fab (nm) | FSB/HT (MHz) | Southbridge | Features / Notes |
---|---|---|---|---|---|---|---|
AMD-640 chipset | AMD-640 | 1997 | K6, | ? | 66
(FSB) |
AMD-645 | AMD licensed VIA Technologies' Apollo VP2/97 |
AMD-750 chipset | AMD-751 | 1999 | Athlon, Duron | 100
(FSB) |
AMD-756,
VIA-VT82C686A |
AGP 2×, SDRAM Irongate chipset family; early steppings had issues with AGP 2×; drivers often limited support to AGP 1×; later fixed with "super bypass" memory access adjustment.[1] | |
AMD-760 chipset | AMD-761 | Nov 2000 | Athlon, Athlon XP, Duron | 133
(FSB) |
AMD-766,
VIA-T82C686B |
AGP 4×, DDR SDRAM | |
AMD-760MP chipset | AMD-762 | May 2001 | Athlon MP | AMD-766 | AGP 4× | ||
AMD-760MPX chipset | AMD-768 | AGP 4×, Hardware RNG Most initial boards shipped without USB headers due to a fault with the integrated USB controller. Manufacturers included PCI USB cards to cover this shortcoming. A later refresh of the chipset had the USB problem remedied.[2] | |||||
AMD-8000 series chipset | AMD-8111 | Apr 2004 | Opteron | 800
(HT 1.x) |
AMD-8131
AMD-8132 |
Hardware RNG |
A-Link Express II
A-Link Express and A-Link Express II are essentially PCIe 1.1 x4 lanes.
See Comparison of ATI Chipsets for the comparison of chipsets sold under the ATI brand for AMD processors, before AMD's acquisition of ATI.
Model | Codename | Released | CPU support | Fab (nm) | HT (MHz) | IGP | CrossFire | Southbridge | Features / Notes |
---|---|---|---|---|---|---|---|---|---|
AMD 480X chipset (originally CrossFire Xpress 1600) |
RD480 | Oct 2006 | Athlon 64, Sempron |
110 | 1000
(HT 2.0) |
No | x8 + x8 | SB600, ULi-M1575 | ? |
AMD 570X/550X chipset (originally CrossFire Xpress 3100) |
RD570 | Jun 2007 | Phenom,[3] Athlon 64, Sempron |
? | No | x16 + x8 | SB600 | ||
AMD 580X chipset (originally CrossFire Xpress 3200) |
RD580 | Oct 2006 | x16 + x16 | ||||||
AMD 690V chipset | RS690C | Feb 2007 | Athlon 64, Sempron |
80 | 1000
(HT 2.0) |
Radeon X1200 (350MHz) |
No | SB600 | DirectX 9.0, AVIVO, HDMI/HDCP, no LVDS |
AMD 690G chipset | RS690 | Phenom, Athlon 64, Sempron |
Radeon X1250 (400MHz) |
DirectX 9.0, AVIVO, HDMI/HDCP | |||||
AMD M690V chipset | RS690MC | Turion 64 X2, Athlon 64 X2 mobile |
800
(HT 2.0) |
Radeon X1200 (350 MHz) |
No | DirectX 9.0, AVIVO, DVI, HDMI/HDCP, no LVDS, Powerplay 7.0 | |||
AMD M690 chipset | RS690M | Radeon X1250 (350 MHz) |
DirectX 9.0, AVIVO, DVI/HDCP, no HDMI, Powerplay 7.0 | ||||||
AMD M690E chipset | RS690T | Athlon Neo, Mobile Sempron |
Radeon X1250 (350Mhz) |
No | DirectX 9.0, AVIVO, 2× HDMI/HDCP, Powerplay 7.0 | ||||
AMD M690T chipset | Turion 64 X2, Athlon 64 X2 mobile |
Radeon X1270 (400Mhz) |
DirectX 9.0, AVIVO, HDMI/HDCP, Powerplay 7.0 | ||||||
AMD 740 chipset | RX740 | 2008 | Athlon 64, Phenom, Sempron |
55 | 1000
(HT 2.0) |
No | No | SB600, SB700, SB750 |
Single PCIe 1.1 x16 |
AMD 740G chipset | RS740 | Radeon 2100 | DirectX 9.0, AVIVO, HDMI/HDCP, OR single PCIe 1.1 x16 | ||||||
AMD 760G chipset | RS780L | 2009 | 2600
(HT 3.0) |
Radeon 3000 | Hybrid | SB710 | DirectX 10, AVIVO HD, HDMI/HDCP, OR single PCIe 2.0 x16 | ||
AMD 770 chipset | RX780 | 2008 | 65 | No | No | SB600, SB700, SB710, SB750 |
Single PCIe 2.0 x16 | ||
AMD 780V chipset | RS780C | 55 | Radeon 3100 | No | SB700, SB710, SB750 |
DirectX 10, AVIVO HD, HDMI/HDCP, DisplayPort/DPCP, OR single PCIe 2.0 x16 | |||
AMD 780G chipset | RS780I | Radeon HD 3200 | Hybrid | DirectX 10, UVD+, HDMI/HDCP, DisplayPort/DPCP, Side-port memory, OR single PCIe 2.0 x16 | |||||
AMD M780V chipset | RS780MC | Mobile Turion, Mobile Athlon, Athlon Neo |
Radeon 3100 | PowerXpress AXIOM/MXM module(s) |
SB600, SB700, SB710 |
DirectX 10, UVD+, HDMI/HDCP, DisplayPort, DVI, VGA, OR single PCIe 2.0 x16 | |||
AMD M780G chipset | RS780M | Radeon HD 3200 | |||||||
AMD 785G chipset | RS880 | 2009 | Athlon 64, Phenom, Sempron |
Radeon HD 4200 | Hybrid, x16 + x4 |
SB710, SB750, SB810, SB850 |
DirectX 10.1, UVD2, Side-port memory, HDMI/HDCP, DisplayPort/DPCP, OR two PCIe 2.0 x16 TDP: 11 W (500 MHz), 3 W in PowerPlay | ||
785E | RS785E | ? | 2200
(HT 3.0) |
Radeon HD 4200 | Hybrid | SB810, SB850, SB820M | |||
AMD 790GX chipset | RS780D | 2008 | Athlon 64, Phenom, Sempron |
2600
(HT 3.0) |
Radeon HD 3300 | Hybrid, x8 + x8[4] |
SB750 | DirectX 10, UVD+, Side-port memory, HDMI/HDCP, DisplayPort/DPCP, OR two PCIe 2.0 x16 | |
AMD 790X chipset | RD780 | 65 | No | x8 + x8 | SB600, SB700, SB750, SB850 |
Two PCIe 2.0 x16 | |||
AMD 790FX chipset | RD790 | Nov 2007 | No | CrossFire X (dual x16 or quad x8) |
SB600, SB750, SB850 |
Up to four PCIe 2.0 x16 Support for AMD Quad FX platform (FASN8), Dual socket enthusiast platform with NUMA, optional single socket variant, 720-pin 1.1 V FC-BGA | |||
Model | Codename | Released | CPU support | Fab (nm) | HT (MHz) | IGP | CrossFire | Southbridge | Features / Notes |
A-Link Express III
A-Link Express III is essentially PCIe 2.0 x4 lanes.
Model | Code name |
Released | CPU support | Fab (nm) |
HT (MHz) |
AMD-V (Hardware Virtualization) |
IGP | CrossFire | SLI[5] | TDP (W) |
Southbridge | Features / Notes |
---|---|---|---|---|---|---|---|---|---|---|---|---|
AMD 870 chipset | RX880 | 2010 | Phenom II, Athlon 64, Sempron |
65 | 2600 (HT 3.0) |
? | No | Hybrid, x16 + x4 | No | ? | SB850 | Single PCIe 2.0 x16 |
AMD 880G chipset | RS880P | Q4 2010 | Phenom II, Athlon II, Sempron |
55 | ? | Radeon HD 4250 | Hybrid | No | SB710, SB750, SB810, SB850, SB920, SB950 |
DirectX 10.1, UVD2, HDMI/HDCP, DisplayPort/DPCP, OR single PCIe 2.0 x16 AM3+ socket support | ||
AMD 880M chipset | RS880M | Q2 2010 | Mobile Turion II, Mobile Athlon II, Mobile Sempron |
? | Radeon HD 4200 | PowerXpress AXIOM/MXM module(s) |
No | SB820 | DirectX 10.1, UVD2, HDMI/HDCP, DisplayPort, DVI, VGA, sideport memory, OR single PCI-E 2.0 x16 Mobile Chipset, Tigris platform | |||
AMD 880M chipset | Athlon II Neo, Turion II Neo |
Radeon HD 4225 | No | DirectX 10.1, UVD2, HDMI/HDCP, DisplayPort, DVI, VGA, OR Single PCI-E 2.0 x16 Mobile Chipset, Nile platform | ||||||||
AMD 880M chipset | Mobile Phenom II, Mobile Turion II, Mobile Athlon II, Mobile Sempron V-Series |
Radeon HD 4250 Radeon HD 4270 |
No | DirectX 10.1, UVD2, HDMI/HDCP, DisplayPort, DVI, VGA, OR single PCI-E 2.0 x16 Mobile Chipset, Danube platform | ||||||||
AMD 890GX chipset | RS880D | Phenom II, Athlon II, Sempron |
? | Radeon HD 4290 | Hybrid, x8 + x8 |
No | 22 | SB710, SB750, SB810, SB850 |
DirectX 10.1, UVD2, HDMI/HDCP, DisplayPort/DPCP, Side-port memory, OR two PCIe 2.0 x16 | |||
AMD 890FX chipset | RD890 | Bulldozer,[6] Phenom II, Athlon II, Sempron |
65 | Yes[7] | No | x16 + x16 or x8 quad |
No | 18 | SB710, SB750, SB810, SB850 |
Four PCIe 2.0 x16 | ||
AMD 970 chipset | RX980 | Q2 2011 | Bulldozer, Piledriver Phenom II, Athlon II, Sempron, FX |
65 | 2400 (HT 3.0) |
Yes[8] | No | x16 + x4 | No | 13.6 | SB710, SB750, SB810, SB850, SB920, SB950 |
Single PCIe 2.0 x16, IOMMU
AM3+ socket support |
AMD 990X chipset | RD980 | 2600 (HT 3.0) |
x8 + x8 | x8 + x8 | 14 | Two PCIe 2.0 x16, IOMMU
AM3+ socket support | ||||||
AMD 990FX chipset | RD990 | x16 + x16 or x8 quad |
x16 + x16 or x16 + x8 + x8 or x8 quad |
19.6 | Four PCIe 2.0 x16, IOMMU
AM3+ socket support | |||||||
Model | Code name |
Released | CPU support | Fab (nm) |
HT (MHz) |
AMD-V (Hardware Virtualization) |
IGP | CrossFire | SLI | TDP (W) |
Southbridge | Features / Notes |
Southbridges
AMD-xxx
Model | Codename | Released | Fab (nm) | USB 2.0 + 1.1 |
Audio | Parallel ATA1 | Features / Notes |
---|---|---|---|---|---|---|---|
AMD 640 chipset | AMD-645 | 1997 | 2 × ATA/33 | ||||
AMD 750 chipset | AMD-756 | 1999 | 0 + 4 | 2 × ATA/66 | |||
AMD 760 chipset | AMD-766 | 2001 | 2 × ATA/100 | ||||
AMD 760MPX chipset | AMD-768 | AC'97 | |||||
Geode GX1 | Geode CS5530 | AC'97 | 2 × ATA/33 | National Semiconductor release | |||
Geode GXm Geode GXLV |
Geode CS5530A | ||||||
Geode GX | Geode CS5535 | 0 + 4 | 2 × ATA/66 | ||||
Geode LX | Geode CS5536 | 4 + 0 | 2 × ATA/100 | ||||
AMD-8111 nForce Professional ULi-1563 |
AMD-8131 | 2004 | 4 + 2 | AC'97 | 2 × ATA/133 | PCI-X | |
AMD-8132 | PCI-X 2.0 | ||||||
AMD-8151 | AMD-8151 | AGP 8X |
1 Parallel ATA, also known as Enhanced IDE supports up to 2 devices per channel.
A-Link Express
- All models support eSATA implementations of available SATA channels.
Model | Codename | Released | Fab
(nm) |
SATA | USB 2.0 + 1.1 |
Parallel ATA1 | RAID | NIC | Package | TDP
(W) |
Features / Notes |
---|---|---|---|---|---|---|---|---|---|---|---|
AMD 480/570/580/690 CrossFire Chipset |
SB600 | 2006 | 130 | 4 × 3 Gbit/s AHCI 1.1 SATA Revision 2.0 |
10 + 0 | 1 × ATA/133 | 0,1,10 | No | 548-pin FC-BGA |
4.0 | |
AMD 700 chipset series | SB700 | Q1 2008 | 6 × 3 Gbit/s AHCI 1.1 SATA Revision 2.0 |
12 + 2 | 1 × ATA/133 | No | 4.5 | DASH 1.0 | |||
SB700S | DASH 1.0 Server southbridge | ||||||||||
SB710 | Q4 2008 | DASH 1.0 | |||||||||
SB750 | 0,1,5,10 | ||||||||||
AMD 800 chipset series |
SB810 | Q1 2010 | 65 | 6 × 3 Gbit/s AHCI 1.2 SATA Revision 2.0 |
14 + 2 | No | 0,1,10 | 10/100/1000 | 605-pin FC-BGA |
6.0 | |
SB850 | 6 × 6 Gbit/s AHCI 1.2 SATA Revision 3.0 |
0,1,5,10 | |||||||||
SB820M | 0,1 | 3.4 - 5.3 | mobile/embedded | ||||||||
AMD 900 chipset series |
SB920 | May 30, 2011 | 6 × 6 Gbit/s AHCI 1.2 SATA Revision 3.0 |
No | 0,1,10 | 10/100/1000 | 6.0 | ||||
SB950 | 0,1,5,10 | ||||||||||
Model | Codename | Released | Fab (nm) | SATA | USB 2.0 + 1.1 |
Parallel ATA1 | RAID | NIC | Package | TDP (W) | Features / Notes |
1 Parallel ATA, also known as Enhanced IDE supports up to 2 devices per channel.
Fusion controller hubs (FCH)
For AMD APU models from 2011 until 2016. AMD is marketing their chipsets as Fusion Controller Hubs (FCH), implementing it across their product range in 2017 alongside the release of the Zen architecture. Before then, only APUs used FCHs, while their other CPUs still used a northbridge and southbridge. The Fusion Controller Hubs are similar in function to Intel's Platform Controller Hub.
Model | Codename | UMI | SATA | USB 3.0+2.0+1.1 |
RAID | NIC | 33 MHz PCI | SD[S 1] | VGA DAC | TDP
(W) |
Features / notes | Part number |
---|---|---|---|---|---|---|---|---|---|---|---|---|
Mobile | ||||||||||||
A55T | Hudson-M2T[N 1] | ×2 Gen 1 | 1× 3 Gbit/s AHCI 1.1 |
0 + 8 + 0 | No | No | No | SDIO | No | |||
A50M | Hudson-M1[N 1] | ×4 Gen 1[M 1] | 6× 6 Gbit/s AHCI 1.2 |
0 + 14 + 2 | No | 5.9[9] | ~920 mW idle | 100-CG2198[9] | ||||
A60M | Hudson-M2[N 1] | ×4 Gen 1 +DP | 0,1 | 10/100/1000 | Yes | Yes | 4.7 | |||||
A68M | Hudson-M3L[N 1] | 2× 6 Gbit/s AHCI 1.2 |
2 + 8 + 0 | No | ~750 mW idle | 218-0792006 | ||||||
A70M | Hudson-M3[N 1] | 6× 6 Gbit/s AHCI 1.2 |
4 + 10 + 2 | Yes | First native USB 3.0 controller[10] |
100-CG2389[9] | ||||||
A76M | Bolton-M3[N 1] | 218-0844012 | ||||||||||
Desktop | ||||||||||||
A45 | Hudson-D1[N 2] | ×4 Gen. 2[M 2] | 6× 3 Gbit/s AHCI 1.1 |
0 + 14 + 2 | No | No | Up to 4 slots | No | No | 218-0792008 | ||
A55 | Hudson-D2[N 2] | ×4 Gen 2 +DP | 0,1,10 | 10/100/1000 | Up to 3 slots | Yes | Yes | 7.6 | ||||
A58 | Bolton-D2[N 2] | ×4 Gen 2 | 6× 3 Gbit/s AHCI 1.3 |
218-0844023 | ||||||||
A68H | Bolton-D2H[N 2] | 4× 6 Gbit/s AHCI 1.3 |
2 + 10 + 2 | xHCI 1.0 | 218-0844029-00 | |||||||
A75 | Hudson-D3[N 2] | ×4 Gen 2 +DP | 6× 6 Gbit/s AHCI 1.2 |
4 + 10 + 2 | 10/100/1000 | 7.8[9] | First native USB 3.0 controller[10] |
100-CG2386[9] | ||||
A78 | Bolton-D3[N 2] | 6× 6 Gbit/s AHCI 1.3 |
7.8 | xHCI 1.0 | 218-0844014 | |||||||
A85X | Hudson-D4[N 2] | 8× 6 Gbit/s AHCI 1.2 |
0,1,5,10 | 10/100/1000 | USB 3.0 (xHCI 0.96) | 218-0755117 | ||||||
A88X | Bolton-D4[N 2] | ×4 Gen 2 | 8× 6 Gbit/s AHCI 1.3 |
USB 3.0 (xHCI 1.0) | 218-0844016 | |||||||
Embedded | ||||||||||||
A55E | Hudson-E1[N 3] | ×4 Gen 2 | 6× 6 Gbit/s AHCI 1.2 |
0 + 14 + 2 | 0,1,5,10 | 10/100/1000 | Up to 4 slots | No | No | 5.9[9] | 100-CG2293[9] | |
A77E[11] | Bolton-E4[N 3] | 1-, 2-, or 4-lane 2 or 5 GB/s |
6× 6 Gbit/s AHCI 1.3 |
4 + 10 + 2 | Up to 3 slots | Yes | Yes | 4-lane PCIe 2.0 | 218-0844020-00 | |||
Model | Codename | UMI | SATA | USB 3.0+2.0+1.1 |
RAID | NIC | 33 MHz PCI | SD[S 1] | VGA DAC | TDP (W) | Features / notes | Part number |
Secure Digital:
Codename:
UMI:
AM4 chipsets
There are currently 3 generations of AM4-based chipsets on the market. Models beginning with the numeral "3" are representatives of the first generation, those with "4" the second generation, etc.
In addition to their traditional chipsets, AMD offers chipsets with "processor-direct access", exclusively through OEM partners.[12] Enthusiast publication igor'sLAB obtained leaked documents about an AMD "Knoll Activator" that enables "activating... processor I/O and processor features in the absence of an alternative AMD chipset." It is concluded that motherboards with the Knoll Activator would be built with I/O from the processor and low-cost I/O chips.[13]
Individual chipset models differ in the number of PCI Express lanes, USB ports, and SATA connectors, as well as supported technologies; the table below shows these differences.[14][15]
Model | Release date | PCIe support[lower-alpha 1] | Multi-GPU | USB support[lower-alpha 2] | Storage features | Processor overclocking |
TDP | CPU support | Architecture | |||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
CrossFire | SLI | SATA ports | RAID | AMD StoreMI | Excavator | Zen | Zen+ | Zen 2 | Zen 3 | |||||||
A300 | Feb 2017 | None | Untested | None | None | Yes[16] | No[17] | No | ~120 μW[lower-alpha 3] | No | Yes[18][19] | Knoll Express[20] | ||||
X300 | Yes | Yes[21] | ||||||||||||||
Pro 500 | Jan 2020[22] | Unknown | No | Partial[lower-alpha 4] | ||||||||||||
A320 | Feb 2017[23][24] | PCIe 2.0 ×4 | No | No | 1, 2, 6 | 4 | 0, 1, 10 |
No | Limited[lower-alpha 5] | ~5.8 W[25] | Yes | Yes | Yes | Varies[lower-alpha 6] | Promontory | |
B350 | PCIe 2.0 ×6 | Yes | 2, 2, 6 | Yes | ||||||||||||
X370 | PCIe 2.0 ×8 | Yes | 2, 6, 6 | 8 | ||||||||||||
B450 | Mar 2018[26] | PCIe 2.0 ×6 | No | 2, 2, 6 | 4 | Yes | Yes, with PBO |
Varies[lower-alpha 7] | Yes | Varies[lower-alpha 7][27] | ||||||
X470 | PCIe 2.0 ×8 | Yes | 2, 6, 6 | 8 | ||||||||||||
A520 | Aug 2020[28] | PCIe 3.0 ×6 | No | 1, 2, 6 | 4 | No | Varies | |||||||||
B550[lower-alpha 8] | Jun 2020[29][30] | PCIe 3.0 ×10 | Yes | Varies | 2, 2, 6 | 6 | Yes, with PBO |
~7W | ||||||||
X570 | Jul 2019[31][32] | PCIe 4.0 ×16 | Yes | 8, 0, 4 | 12 | ~15 W[33][34][lower-alpha 9] | No | Yes | Yes | Bixby |
- ↑ PCIe lanes provided by the chipset. The CPU provides other PCIe 3.0 or 4.0 lanes.
- ↑ USB 3.2 Gen 2, USB 3.2 Gen 1, USB 2.0
- ↑ Knoll chipsets consume "insignificant power ...after [boot] in sleep mode", power figure based on a typical SPI controller
- ↑ Limited to specific SKUs branded as Ryzen Pro and Athlon Pro
- ↑ Only pre-Zen CPUs can be overclocked.
- ↑ BIOS update needed. Availability may depend on manufacturer.
- 1 2 Beta BIOS updates may be made available by motherboard manufacturers.
- ↑ OEM-only B550A is a rebranded B450
- ↑ 7 watts on passive cooling (termed X570s).
The 300 series, 400 series, and the B550 chipsets are designed in collaboration with ASMedia and the family is codenamed Promontory.[35] The X570 is designed by AMD with IP licensed from ASMedia and other companies and is codenamed Bixby.[36] Network interface controller, Wi-Fi, and Bluetooth are provided by external chips connected to the chipset through PCIe or USB. All 300 series chipsets are made using 55 nm lithography.[37] The X570 chipset is a repurposed Matisse/Vermeer IO die made using a 14 nm process.[38]
TR4 chipsets
Supports both 1st and 2nd generation AMD Ryzen Threadripper processors.[39]
Model | CPU PCIe Link |
PCIe support | Multi-GPU support | SATA + SATA Express | USB 3.1 Gen2 + 3.1 Gen1 + 2.0 |
RAID | Overclocking | TDP | Chipset lithography | |
---|---|---|---|---|---|---|---|---|---|---|
CrossFire | SLI | |||||||||
X399[40][39] | ×4 | PCIe 2.0 ×8 | Yes | Yes | 4 + 2 | 2 + 14 + 6 | 0,1,10 | Yes | 5 W[41] | Unknown |
sTRX4 chipsets
Supports 3rd generation AMD Ryzen Threadripper (3960X to 3990X) processors.[42]
Model | CPU PCIe Link |
PCIe support | Multi-GPU support | SATA | USB 3.1 Gen2 + 2.0 |
RAID | Overclocking | TDP | Chipset lithography | Notes | |
---|---|---|---|---|---|---|---|---|---|---|---|
CrossFire | SLI | ||||||||||
TRX40[42] | ×8 | PCIe 4.0 ×8 | Yes | Yes | 4 (+ up to 2 × 4 extra) | 8 + 4 | 0,1,10 | Yes | 15 W[41] | 14 nm | HW-wise identical to X570 |
Although the X399, TRX40 and WRX80 motherboards' CPU sockets use the same number of pins, the sockets are incompatible with each other due to ID pins and no-connects of some pins. Twelve TRX40 motherboards were released at launch in November 2019. The TRX40 chipset does not support the HD Audio interface on its own, so motherboard vendors must include a USB audio device or a PCIe audio device on TRX40 motherboards to integrate audio codecs.[41]
sWRX8 chipsets
Supports 3rd (3900WX) and 4th generation (5900WX) AMD Ryzen Threadripper Pro processors.[43]
Model | CPU PCIe Link |
PCIe support | Multi-GPU support | SATA | USB 3.1 Gen2 + 2.0 |
RAID | Overclocking | TDP | Chipset lithography | Notes | |
---|---|---|---|---|---|---|---|---|---|---|---|
CrossFire | SLI | ||||||||||
WRX80 | ×8 | PCIe 4.0 ×16 | Yes | Yes | 4 | 8 + 4 | 0,1,10 | Yes | 15 W | 14 nm | HW-wise identical to EPYC/Threadripper IO die |
Although the X399, TRX40 and WRX80 motherboards' CPU sockets use the same number of pins, the sockets are incompatible with each other due to ID pins and no-connects of some pins.[41] Three WRX80 motherboards were released at launch in March 2021. The WRX80 chipset does not support the HD Audio interface on its own, so motherboard vendors must include a USB audio device or a PCIe audio device on WRX80 motherboards to integrate audio codecs.
AM5 chipsets
AMD uses a single Promontory 21 chipset for all configurations that include a chipset. A single Promontory 21 chip provides four SATA III ports and twelve PCIe 4.0 lanes. Four lanes are reserved for the chipset uplink to the CPU while another four are used to connect to another Promontory 21 chip in a daisy-chained topology for X670 chipsets.[44]
Model | Release date |
Chipset PCIe lanes[lower-alpha 1] |
Multi-GPU | USB support[lower-alpha 2] | Storage features | Processor overclocking |
TDP | CPU support | Architecture | Chipset links | Ref. | |||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
CrossFire | SLI | SATA ports | RAID | Zen 4 | CPU | Interchipset | ||||||||
A620 | Mar 2023 | PCIe 3.0 ×8 | No | No | 0, 2, 2, 6 | 4 | 0, 1, 10 |
No | ~4.5W | Yes | Promontory 21 ×1 |
PCIe 4.0 ×4 | — | [45][46] |
B650 | Oct 2022 | PCIe 4.0 ×8 PCIe 3.0 ×4 |
Yes | 1, 4, 0, 6 or 0, 6, 0, 6 |
Yes | ~7W | [47] [48] | |||||||
B650E[lower-alpha 3] | ||||||||||||||
X670 | Sep 2022 | PCIe 4.0 ×12 PCIe 3.0 ×8 |
2, 8, 0, 12 or 1, 10, 0, 12 or 0, 12, 0, 12 |
8[lower-alpha 4] | ~14W[lower-alpha 5] | Promontory 21 ×2 |
PCIe 4.0 ×4 | [47] [48] | ||||||
X670E[lower-alpha 3] |
- ↑ PCIe lanes provided by the chipset. The CPU provides other PCIe 5.0 lanes.
- ↑ USB 3.2 Gen 2x2, USB 3.2 Gen 2, USB 3.2 Gen 1, USB 2.0
- 1 2 E or "Extreme" branding is a guarantee that PCIe 5.0 is supported on both the motherboard's graphics slot and NVMe slots. E models provide access to all 24 PCIe 5.0 lanes from the processor. Non-E models only support 8 PCIe 5.0 lanes on NVMe slots while the rest of the lanes on graphics slots are dropped to PCIe 4.0.
- ↑ Each Promontory 21 chipset provides 4 SATA ports for a total of 8.
- ↑ Motherboards marketed as X670 and X670E feature two Promontory 21 chipsets, each having a TDP of ~7W.
sTR5 chipsets
The sTR5 socket has two chipset options available, TRX50 and WRX90:
- TRX50 is an HEDT platform which is intended to be paired with Threadripper (7000X) series processors, but is also compatible with Threadripper Pro models. When a Threadripper Pro CPU is paired with a TRX50 motherboard, extra features like enterprise management and security won't be available to the user, and PCIe lanes and memory channels will still be limited to that of non-Pro Threadripper.
- WRX90 is a workstation platform for Threadripper Pro (7000WX) series processors. It is not compatible with the Threadripper non-Pro 7000X series.[49]
HD audio support is provided by the CPU, rather than by the chipset.[50]
Model | CPU PCIe Link |
PCIe support | Multi-GPU support | SATA | USB 3.1 Gen2x2 + 3.1 Gen2 + 2.0 |
RAID | Overclocking | TDP | Chipset lithography | Notes | |
---|---|---|---|---|---|---|---|---|---|---|---|
CrossFire | SLI | ||||||||||
TRX50[51] | PCIe 4.0 ×8 | 4 | 1 + 4 + 4 | Yes | |||||||
WRX90[50][51] | ×4 |
See also
References
- ↑ "AMD's Super Bypass - AMD Improves their 750 Chipset". Tom's Hardware. December 29, 1999.
- ↑ "AMD-768 Peripheral Bus Controller Revision Guide" (PDF). AMD. March 2002. Archived from the original (PDF) on March 31, 2004.
- ↑ AMD Phenom Motherboard compatibility matrix
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the X570 platform is targeting a release of Computex 2019, which takes place between May 28th and June 1st.
- ↑ Hassan Mujtaba (2019-05-27). "AMD X570 Motherboard Roundup – Featuring X570 AORUS Xtreme, ASRock X570 Taichi, MSI MEG X570 GODLIKE, ASUS Crosshair VIII HERO & More". wccftech. Retrieved 2019-07-10.
slide
- ↑ Gavin Bonshor (2019-05-26). "AMD Reveals the X570 Chipset: PCIe 4.0 is Here". AnandTech. Retrieved 2020-08-19.
One of the caveats to a more powerful chipset is that it draws around 11 W of power.
- ↑ "AMD X570 Unofficial Platform Diagram Revealed, Chipset Puts out PCIe Gen 4". TechPowerUp. 2019-05-20. Retrieved 2020-08-19.
The source also mentions the TDP of the AMD X570 chipset to be at least 15 Watts, a 3-fold increase over the X470 with its 5W TDP.
- ↑ Ian Cutress (2017-03-02). "Making AMD Tick: A Very Zen Interview with Dr. Lisa Su, CEO". AnandTech. Retrieved 2019-06-10.
- ↑ Gavin Bonshor. "AMD Reveals the X570 Chipset: PCIe 4.0 is Here". AnandTech. Retrieved 2019-06-10.
- ↑ Ian Cutress (2017-03-02). "Making AMD Tick: A Very Zen Interview with Dr. Lisa Su, CEO". AnandTech. Retrieved 2019-06-10.
Q6: It has been noted that AMD has been working with ASMedia on the chipset side of the platform, using a 55nm PCIe 3.0x4 based chipset.
- ↑ Dr. Ian Cutress [@IanCutress] (June 11, 2019). "So for clarity: Rome large IO die = GF 14nm Matisse small IO die = GF 12nm X570 Chipset = Matisse IO die on GF 14nm That's right. The X570 chipset is the same floorplan as the Matisse, but with diff chicken bits enabled/disabled. AMD has good reuse of chips" (Tweet). Archived from the original on November 7, 2020. Retrieved October 5, 2021 – via Twitter.
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