Names | |
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IUPAC name
tetrafluorotungsten | |
Other names
Tungsten(4+) tetrafluoride, Tungsten tetrafluoride | |
Identifiers | |
3D model (JSmol) |
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ChemSpider | |
EC Number |
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PubChem CID |
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CompTox Dashboard (EPA) |
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Properties | |
WF4 | |
Molar mass | 259.8336128 g/mol |
Appearance | Red-Brown or Black Solid[1] |
Related compounds | |
Other anions |
Tungsten(IV) chloride |
Except where otherwise noted, data are given for materials in their standard state (at 25 °C [77 °F], 100 kPa).
Infobox references |
Tungsten tetrafluoride is an inorganic compound with the formula WF4. This little studied solid has been invoked, together with tungsten pentafluoride, as an intermediate in the chemical vapor deposition of tungsten films using tungsten hexafluoride.[2]
Structure
Tungsten tetrafluoride was found to have polymeric structure based on Mössbauer spectroscopy.[3]
Preparation
It has been prepared by treatment of the coordination complex WCl4(MeCN)2 with AsF3.[4] It has been produced by from the reaction of WF6 and a W filament at 600-800 °C.[1]
Reactions
The compound can be re-oxidized to W(VI) compounds by treatment with fluorine and chlorine:
- WF4 + X2 → WF4X2
Upon heating, it disproportionates to WF6 and tungsten metal.[1]
References
- 1 2 3 Butskii, V. D.; Perov, V. S. (1977). "Synthesis and certain properties of tungsten tetrafluoride". Zhurnal Neorganicheskoi Khimii. 22 (1): 14–17.
- ↑ Creighton, J. R. (1989). "Selectivity loss during tungsten chemical vapor deposition: The role of tungsten pentafluoride". Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films. 7 (3): 621–624. Bibcode:1989JVSTA...7..621C. doi:10.1116/1.575854.
- ↑ Dzhevitskij, B. Eh; Savvateev, N. N.; Butskij, V. D.; Fal'Kengof, A. T.; Novotortsev, V. M.; Rakitin, Yu V.; Pervov, V. S. (1980). "Moessbauer spectrum and magnetic properties of tungsten tetrafluoride". Zhurnal Neorganicheskoj Khimii. 25 (9): 2327–2329.
- ↑ Meinert, Hasso; Dimitrov, A. "On the chemistry of tungsten tetrafluoride" Zeitschrift für Chemie (1976), 16(1), 29-30.
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